From board-level architecture to certified mass production, INDORCE turns ambitious AIoT and industrial computing ideas into dependable products.
A secure and trusted partner — building hardware, deploying AI, at scale.
A representative AI edge system — silicon, memory, power, and I/O sourced, laid out, and integrated by our engineering team. Hover any component to see its role.
Silicon, memory, power, and I/O — each block sourced, validated, and integrated by our engineering team. From layout to impedance budget, every detail is owned in-house.
Runs the OS, schedules every workload, orchestrates the rest of the chip. Our octa-core application processor is the foundation of our high-performance ARM designs.
Hardware-accelerated inference for vision, ANPR, anomaly detection, and edge analytics. 6 TOPS at INT8 lets the system run models locally — no round-trip to the cloud.
UI rendering for signage and kiosks, parallel compute fallback when the NPU is at capacity, and 8K display compositing for digital signage walls.
Dual-channel low-power DDR5. Bandwidth headroom for AI workloads with large model contexts and high-throughput memory access patterns.
Second memory channel. Dual-channel configuration doubles peak bandwidth, letting memory-bound AI workloads scale linearly.
Local persistent storage for the OS, model weights, and recent inference history. PCIe Gen4 means model cold-loads complete in well under a second.
Tri-band Wi-Fi 6E and Bluetooth 5.2. For fleet telemetry, signage OTA updates, and remote diagnostics — without dedicated wired infrastructure.
Single-cable up to 8K @ 60Hz with HDR. Used in digital signage, dual-output workstation designs, and 4K conference systems.
Sequences every power rail, monitors temperature, gracefully handles brown-outs, and runs reliably from a USB-C PD source between 5–12 V.
USB 3.0 hub, Gigabit Ethernet, and the GPIO header. Where the system meets the outside world — sensors, peripherals, and the rest of the deployment.
Fanless industrial PCs, mini systems, and embedded modules.
x86 and ARM mainboards, vertically integrated.
Jetson and RAVE platforms for sub-50ms inference.
Ruggedized Android tablets for conference, fleet, and field.
Interactive kiosks, stretched displays, dual-display systems.
AI cameras, 5G gateways, and the iNFollow ecosystem.
From concept and mechanical design to mass production.
In-vehicle telematics, fleet gateways, and ruggedized automotive-grade computing.
Hardware, AI infrastructure and manufacturing decisions stay connected from day one.
Workload, environment, volumes and compliance.
Electronics, mechanics, firmware and UX.
EVT, DVT, reliability and certification.
NPI, fixtures, QA and mass production.
Lifecycle, revisions, RMA and supply continuity.
